Light emitting device and lighting apparatus having enhanced optical and electrical characteristics by diffusion barrier layer

ABSTRACT

A light emitting device includes a substrate; a light emitting structure disposed on the substrate; a first insulation layer disposed on the light emitting structure; a second insulation layer disposed on the first insulation layer; a first electrode and a second electrode electrically connected to the light emitting structure; a first pad electrically connected to the first electrode; and a second pad electrically connected to the second electrode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a Continuation of U.S. patent application Ser. No.16/363,178 filed on Mar. 25, 2019 (now U.S. Pat. No. 10,411,166 issuedon Sep. 10, 2019), which is a Continuation of U.S. patent applicationSer. No. 16/215,238 filed on Dec. 10, 2018 (now U.S. Pat. No. 10,333,031issued on Jun. 25, 2019), which is a Continuation of U.S. patentapplication Ser. No. 15/315,938 filed on Dec. 2, 2016 (now U.S. Pat. No.10,186,639 issued on Jan. 22, 2019), which is the National Phase of PCTInternational Application No. PCT/KR2015/005265 filed on May 26, 2015,which claims the priority benefit under 35 U.S.C. § 119(a) to KoreanPatent Application No. 10-2014-0070924 filed in the Republic of Korea onJun. 11, 2014, all of which are hereby expressly incorporated byreference into the present application.

BACKGROUND OF THE INVENTION Field of the Invention

Embodiments relate to a light emitting device and a lighting apparatus.

Discussion of the Related Art

Light emitting diodes (LEDs) are a kind of semiconductor device that isused as a light source or used to transmit or receive a signal byconverting electricity into infrared light or other light, usingcharacteristics of compound semiconductors.

Group III-V nitride semiconductors are being considered as corematerials for light emitting devices such as LEDs and laser diodes(LDs), by virtue of physical and chemical characteristics thereof.

LEDs do not contain any environmental pollution material such as mercury(Hg) used in existing lighting devices such as incandescent lamps orfluorescent lamps and, as such, have an advantage of beingenvironmentally friendly. In addition, LEDs have advantages of longlifespan and low power consumption. In this regard, such LEDs are beingsubstituted for existing light sources.

Research is being conducted to achieve an enhancement in optical andelectrical characteristics of light emitting devices and light emittingdevice packages.

SUMMARY OF THE INVENTION

Embodiments provide a light emitting device and a lighting apparatus,which have enhanced optical and electrical characteristics.

In an embodiment, there is provided a light emitting device including asubstrate, a light emitting structure comprising a first conductivitytype semiconductor layer, an active layer, and a second conductivitytype semiconductor layer disposed on the substrate, a reflective layerdisposed on the light emitting structure, the reflective layer havingfirst and second areas neighboring each other in a horizontal direction,a first electrode disposed to extend to the first conductivity typesemiconductor layer with passing through the second conductivity typesemiconductor layer and the active layer at at least a portion of thefirst area of the reflective layer, a first insulating layer interposedbetween the first electrode and a side surface of the light emittingstructure and between the first electrode and the reflective layer, adiffusion barrier layer disposed at the second area of the reflectivelayer, a second insulating layer disposed on the first electrode and thediffusion barrier layer, and first and second bonding layersrespectively connected to the first electrode and the diffusion barrierlayer with passing through the second insulating layer.

The diffusion barrier layer and the first insulating layer may bedisposed on the reflective layer while being spaced apart from eachother in a direction perpendicular to a thickness direction of the lightemitting structure.

The diffusion barrier layer and the first electrode may be disposed tobe spaced apart from each other in a direction perpendicular to athickness direction of the light emitting structure.

The light emitting device may further include a sub-mount, and first andsecond metal pads disposed on the sub-mount while being spaced apartfrom each other in a horizontal direction. The first and secondconductivity type semiconductor layers may be connected to the first andsecond metal pads, respectively. The light emitting device may furtherinclude a first bump interposed between the first bonding layer and thefirst metal pad, and a second bump interposed between the second bondinglayer and the second metal pad.

The first insulating layer and the second insulating layer may be madeof different materials, respectively. The first insulating layer and thesecond insulating layer may be made of the same material.

The diffusion barrier layer may have a first thickness of 50 nm toseveral nm in a thickness direction of the light emitting structure.

The diffusion barrier layer may have a first width at a portion thereofcontacting the reflective layer at the second area such that the firstwidth is equal to or greater than a second width of a portion of thesecond bonding layer passing through the second insulating layer.

The diffusion barrier layer and the first electrode may be made of thesame material. The diffusion barrier layer and the first electrode maybe made of different materials, respectively.

The diffusion barrier layer may have a first thickness in a thicknessdirection of the light emitting structure such that the first thicknessis greater than a second thickness of the first electrode.

The diffusion barrier layer may include at least one of Ni, Ti, Pt, orW.

The light emitting device may further include a second electrodeelectrically connected to the second conductivity type semiconductorlayer. The diffusion barrier layer and the second electrode may form anintegrated structure.

The diffusion barrier layer may have a circular, oval or polygonalplanar shape.

The diffusion barrier layer and the first insulating layer may have thesame planar shape. The diffusion barrier layer and the first insulatinglayer may have different planar shapes, respectively.

In another embodiment, there is provided a light emitting deviceincluding a substrate, a light emitting structure comprising a firstconductivity type semiconductor layer, an active layer, and a secondconductivity type semiconductor layer disposed on the substrate, areflective layer disposed on the light emitting structure, first andsecond bonding layers disposed on the reflective layer, a diffusionbarrier layer locally interposed between the reflective layer and thesecond bonding layer, a first electrode disposed to extend to the firstconductivity type semiconductor layer with passing through thereflective layer, the second conductivity type semiconductor layer andthe active layer, a first insulating layer interposed between the firstelectrode and a side surface of the light emitting structure and betweenthe first electrode and the reflective layer, and a second insulatinglayer disposed on the first electrode and the diffusion barrier layer,wherein the first and second bonding layers are connected to the firstelectrode and the diffusion barrier layer, respectively, with passingthrough the second insulating layer.

In another embodiment, there is provided a lighting apparatus includingthe light emitting device.

In the light emitting device and lighting apparatus according to eachembodiment, the diffusion barrier layer is interposed between thereflective layer and each bonding layer, to prevent diffusion of theconstituent atoms of the bonding layer into the reflective layer orepitaxial layer, and, as such, it may be possible to avoid problems suchas degradation of reflectance, degradation of electrical characteristicsand degradation of light emission efficiency. In addition, the diffusionbarrier layer is locally disposed on the reflective layer and, as such,peeling-off thereof may be prevented or minimized. Thus, highreliability is secured.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a plan view of a light emitting device according toan embodiment.

FIG. 2 is a cross-sectional view taken along line A-A′ of FIG. 1.

FIG. 3 is a cross-sectional view taken along line B-B′ of FIG. 1.

FIG. 4 illustrates a plan view of the light emitting device of theembodiment illustrated in FIGS. 1 and 2 under the condition that a lowerstructure, a second insulating layer, and first and second bondinglayers are removed from the light emitting device.

FIG. 5 is a sectional view explaining characteristics of the lightemitting device illustrated in FIGS. 1 and 4.

FIG. 6 illustrates a plan view of a light emitting device according toanother embodiment corresponding to of the embodiment illustrated inFIGS. 1 and 2, from which the lower structure and the first and secondbonding layers are removed.

FIGS. 7a to 7h are sectional views explaining respective processes of amethod for manufacturing an upper structure in the light emitting deviceillustrated in FIG. 2.

FIGS. 8a and 8b are sectional views explaining processes of a method formanufacturing the lower structure in the light emitting deviceillustrated in FIG. 2.

FIG. 9 illustrates a sectional view of a light emitting device packageaccording to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. However, the presentdisclosure may be embodied in many different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the disclosure to thoseskilled in the art.

It will be understood that when an element is referred to as being “on”or “under” another element, it can be directly on or under anotherelement or can be indirectly formed such that an intervening element isalso present.

When an element is referred to as being “on” or “under”, “under theelement” as well as “on the element” can be included based on theelement.

Relative terms such as “first”, “second”, “on/above/upper”, and“under/below/lower” may be used herein solely to distinguish one entityor element from another entity or element without necessarily requiringor implying any physical or logical relationship or order between suchentities or elements.

Hereinafter, light emitting devices according to embodiments will bedescribed with reference to the accompanying drawings. The lightemitting devices will be described in conjunction with the case in whichthe light emitting devices are of a flip bonding type, for bestunderstanding thereof, but embodiments are not limited thereto. Forconvenience of description, light emitting devices 100A and 100B will bedescribed using a Cartesian coordinate system (x, y, z) in each drawing,but embodiments may be described using other coordinate systems.

FIG. 1 illustrates a plan view of a light emitting device 100 accordingto an embodiment. FIG. 2 is a cross-sectional view taken along line A-A′of FIG. 1. FIG. 3 is a cross-sectional view taken along line B-B′ ofFIG. 1.

The light emitting device 100A may include a light emitting diode (LED).The LED may be a color LED to emit blue, green or red light, anultraviolet (UV) LED, a deep UV LED or a non-polar LED. Light emissionof such an LED may be implemented using various semiconductors, butembodiments are not limited thereto.

Referring to FIGS. 1 to 3, the light emitting device 100A according tothe embodiment may include a sub-mount 110, a substrate 120, a lightemitting structure 130, a reflective layer 140, an insulating layer 150,a first electrode 162, a diffusion barrier layer (or capping layer) 164,first and second bonding layers (or chip bonding layers or pads) 172 and174, first and second bumps 182 and 184, and first and second metal pads192 and 194.

Hereinafter, the substrate 120, light emitting structure 130, reflectivelayer 140, insulating layer 150, first electrode 162, diffusion barrierlayer (or second electrode) 164, and first and second bonding layers 172and 174 will be referred to as an “upper structure”, and the sub-mount110, first and second bumps 182 and 184, and first and second metal pads192 and 194 will be referred to as a “lower structure”. From FIG. 1,illustration of the lower structure including the element 110 and theelements 182 to 194 is omitted.

First, the upper structure including the elements 120 to 174 will bedescribed.

The light emitting device 100A illustrated in FIGS. 2 and 3 may includethe upper structure including the elements 120 to 174 and the lowerstructure including the element 110 and the elements 182 to 194.

For convenience of description, the upper structure including theelements 120 to 174 will be described in conjunction with the case inwhich the elements 130 to 174 of the upper structure are disposed on thesubstrate 120, as illustrated in FIG. 7h , in place of the case in whichthe elements 130 to 174 of the upper structure are disposed beneath thesubstrate 120, as illustrated in FIGS. 2 and 3.

The substrate 120 may have light transmissivity and, as such, lightemerging from an active layer 134 may be emitted through the substrate120. For example, the substrate 120 may be made of at least one ofsapphire (Al₂O₃), SiC, GaAs, GaN, ZnO, Si, GaP, InP, or Ge, but theembodiment is not limited thereto. The substrate 120 may have mechanicalstrength allowing the substrate 120 to be easily separated into separatechips through a scribing process or a breaking process while preventingthe entire nitride semiconductor from being bent.

A buffer layer (not shown) may be formed between the substrate 120 andthe light emitting structure 130, to perform a function of improvinglattice match between the substrate 120 and the light emitting structure130. For example, the buffer layer may include AlN or undoped nitride,but the embodiment is not limited thereto. The buffer layer may bedispensed with in accordance with the kind of the substrate 120 and thekind of the light emitting structure 130.

The light emitting structure 130 may be disposed on the substrate 120.The light emitting structure 130 may include a first conductivity typesemiconductor layer 132, an active layer 134, and a second conductivitytype semiconductor layer 136.

The first conductivity type semiconductor layer 132 may be interposedbetween the substrate 120 and the active layer 134, and may be made of asemiconductor compound. In particular, the first conductivity typesemiconductor layer 132 may be made of a Group III-V or Group II-VIcompound semiconductor. The first conductivity type semiconductor layer132 may be doped with a first conductivity type dopant. For example, thefirst conductivity type semiconductor layer 132 may include asemiconductor material having a formula of Al_(x)In_(y)Ga_(1-x-y)N(0≤x≤1, 0≤y≤1, and 0≤x+y≤1). The first conductivity type semiconductorlayer 132 may be made of at least one of InAlGaN, AlGaAs, GaP, GaAs,GaAsP, or AlGaInP. When the first conductivity type semiconductor layer132 is an n-type semiconductor layer, the first conductivity type dopantis an n-type dopant such as Si, Ge, Sn, Se, or Te. The firstconductivity type semiconductor layer 132 may be formed to have a singlelayer structure or a multilayer structure, but the embodiment is notlimited thereto.

The active layer 134 may be interposed between on the first conductivitytype semiconductor layer 132 and the second conductivity typesemiconductor layer 136. The active layer 134 may include one of asingle well structure, a multi-well structure, a single quantum wellstructure, a multi-quantum well (MQW) structure, a quantum dotstructure, or a quantum wire structure. The active layer 134 may havewell and barrier layers, using compound semiconductor materials ofGround III-V elements. For example, the active layer 134 may have alayer pair structure made of at least one of InGaN/GaN, InGaN/InGaN,GaN/AlGaN, InAlGaN/GaN, GaAs(InGaAs)/AlGaAs, or GaP(InGaP)/AlGaP, butthe embodiment is not limited thereto. The well layer may be made of amaterial having a lower energy band gap than that of the barrier layer.

The second conductivity type semiconductor layer 136 may be disposed onthe active layer 134. The second conductivity type semiconductor layer136 may be made of a semiconductor compound. In particular, the secondconductivity type semiconductor layer 136 may be made of a Group III-Vor Group II-VI compound semiconductor, and may be doped with a secondconductivity type dopant. The second conductivity type semiconductorlayer 136 may be made of a semiconductor material having a formula of,for example, In_(x)Al_(y)Ga_(1-x-y)N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). The secondconductivity type semiconductor layer 136 may be made of at least one ofAlInN, AlGaAs, GaP, GaAs, GaAsP, or AlGaInP. When the secondconductivity type semiconductor layer 136 is a p-type semiconductorlayer, the second conductivity type dopant is a p-type dopant such asMg, Zn, Ca, Sr, or Ba. The second conductivity type semiconductor layer136 may be formed to have a single layer structure or a multilayerstructure, but the embodiment is not limited thereto.

FIG. 4 illustrates a plan view of the light emitting device 100A of theembodiment illustrated in FIGS. 1 and 2 under the condition that thelower structure including the elements 110 and the elements 182 to 194,a second insulating layer 154 and the first and second bonding layers172 and 174 are removed from the light emitting device 100A.

The cross-sectional taken along line C-C′ of FIG. 4 is the same as FIG.2, and the cross-sectional taken along line D-D′ of FIG. 4 is the sameas FIG. 3.

The reflective layer 140 may be disposed on the second conductivity typesemiconductor layer 136 of the light emitting structure 130. Thereflective layer 140 may include first areas A11 and A12, and a secondarea A2, which are arranged in a horizontal direction in a neighboringmanner. Here, the horizontal direction may be a z-axis directionperpendicular to a thickness direction of the light emitting structure130, namely, an x-axis direction.

The reflective layer 140 may be a material having a property capable ofreflecting light emitted from the light emitting structure 130. Forexample, the reflective layer 140 may be made of Ni, Al, Rh, Pd, Ir, Ru,Mg, Zn, Pt, Au, Hf or a selective combination thereof.

Referring to FIGS. 2 to 4, the first electrode 162 may be arranged withpassing through the first areas A11 and A12 of the reflective layer 140,the second conductivity type semiconductor layer 136, and active layer134 and with extending to the first conduction type semiconductor layer132. That is, the first electrode 162 may be embedded in first blindholes, to be electrically connected to the first conductivity typesemiconductor layer 132. Here, the first blind holes may mean holesextending to the first conduction type semiconductor layer 132 withpassing through portions of the first areas A11 and A12 of thereflective layer 140, the second conductivity type semiconductor layer136, and active layer 134, respectively.

The first electrode 162 may be made of a conductive material. Forexample, the first electrode 162 may be made of the conductive materialsuch as Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf or a selectivecombination thereof.

The first electrode 162 may be a transparent conductive oxide (TCO)film. For example, the first electrode 162 may be made of at least oneof the above-described materials, indium tin oxide (ITO), indium zincoxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide(IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide(IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), galliumzinc oxide (GZO), IrOx, RuOx, RuOx/ITO, Ni/IrOx/Au, or Ni/IrOx/Au/ITO,but the embodiment is not limited thereto.

The first electrode 162 may include a material ohmic-contacting thefirst conductivity type semiconductor layer 132. The first electrodelayer 162 may be formed to have a single layer structure or a multilayerstructure, using a reflective electrode material having ohmiccharacteristics. When the first electrode layer 162 performs an ohmicfunction, no separate ohmic contact layer (not shown) may be formed. Asshown in FIG. 2, the first electrode 162 includes a first contactportion 162-1 contacting the first conductivity type semiconductor layer132, and a first extending portion 162-2 disposed on the secondconductivity type semiconductor layer 136. FIG. 2 also illustrates asecond electrode 142 includes a second contact portion 140 contactingthe second conductivity type semiconductor layer 136, and a secondextending portion 164 disposed on the second contact portion 140.

The insulating layer 150 may include a first insulating layer 152 and asecond insulating layer 154.

The first insulating layer 152 may be interposed between a side surfaceof the light emitting structure 150 and the first electrode 162. Thatis, the first insulating layer 152 may be interposed between a sidesurface 162A of the first electrode 162 and a side surface of the secondconductivity type semiconductor layer 136 and between the side surface162A of the first electrode 162 and a side surface of the active layer134. Also, as shown in FIG. 2, the first insulation layer 152 includes alower portion 152L contacting the first conductivity type semiconductorlayer 132, and an upper portion 152U disposed on the second contactportion 140. Accordingly, the first electrode 162 and the secondconductivity type semiconductor layer 136 may be electrically insulatedfrom each other, and the first electrode 162 may be electricallyinsulated from the active layer 134.

In addition, the first insulating layer 152 may be interposed betweenthe side surface 162A of the first electrode 162 and the reflectivelayer 140. Accordingly, the first electrode 162 and the reflective layer140 may be electrically insulated from each other.

The first insulating layer 152 may include at least one of SiO₂, TiO₂,SnO, ZnO, Si_(x)O_(y), Si_(x)N_(y), SiO_(x)N_(y), ITO, or AZO.

Meanwhile, the diffusion barrier layer 164 may be disposed on the secondarea A2 of the reflective layer 140. That is, the diffusion barrierlayer 164 may be locally interposed between the reflective layer 140 andthe second bonding layer 174. As the diffusion barrier layer 164 may beinterposed between the reflective layer 140 and the second bonding layer174, it may be possible to prevent atoms of the material constitutingthe second bonding layer 174 from being diffused into at least one ofthe reflective layer 140 or light emitting structure 130.

In order to perform the above-described function, the diffusion barrierlayer 164 may include at least one of Ni, Ti, Pt, or W. Meanwhile, thediffusion barrier layer 164 may include an ohmic contact material and,as such, no separate ohmic contact layer (not shown) may be disposed.Alternatively, a separate ohmic contact layer (not shown) may be formedover the diffusion barrier layer 164.

The diffusion barrier layer 164 may not only function to preventdiffusion of constitutive atoms of the second bonding layer 174, butalso perform as a second electrode 142 for supplying second conductivitytype carriers to the second conductivity type semiconductor layer 136.Although the diffusion barrier layer and the second electrode have beendescribed as constituting a single layer structure designated byreference numeral “164”, the second electrode may be formed to take alayer separate from the diffusion barrier layer.

Referring to FIGS. 2 and 3, the diffusion barrier layer 164 and thefirst insulating layer 152 may be disposed to be spaced apart from eachother in a direction perpendicular to the thickness direction of thelight emitting structure 130 above the reflective layer 140. Here, thethickness direction of the light emitting structure 130 may be thex-axis direction, and the direction perpendicular to the x-axisdirection may be the z-axis direction. Accordingly, the diffusionbarrier layer 164 and the first insulating layer 152 may be disposed tobe spaced apart from each other in the z-axis direction by a distancebetween the boundary of the second area A2 and the boundary of the thirdarea A3 above the reflective layer 140.

In addition, the diffusion barrier layer 164 and the first electrode 162may be disposed to be spaced apart from each other in a directionperpendicular to the thickness direction of the light emitting structure130 above the reflective layer 140. Here, the thickness direction of thelight emitting structure 130 may be the x-axis direction, and thedirection perpendicular to the x-axis direction may be the z-axisdirection. Accordingly, the diffusion barrier layer 164 and the firstelectrode 162 may be disposed to be spaced apart from each other in thez-axis direction by a distance between the boundary of the fourth areaA4 and the boundary of the second area A2.

When the constituent atoms of the second bonding layer 174 are diffusedinto the reflective layer 140, the reflectance of the reflective layer140 may be lowered. On the other hand, when the constituent atoms of thesecond bonding layer 174 are diffused into the light emitting structure130, the light emitting structure 130 exhibits increased resistance and,as such, the light emitting device 100A may exhibit degraded electricalcharacteristics and degraded light emission efficiency. To this end, thediffusion barrier layer 164 is arranged in accordance with theembodiment and, as such, it may be possible to avoid problems such asdegradation of reflectance, degradation of electrical characteristics,and degradation of light emission efficiency.

FIG. 5 is a sectional view explaining characteristics of the lightemitting device 100A illustrated in FIGS. 1 to 4.

Due to the thermal stress induced when the diffusion barrier layer 166is thickly formed over the entire upper surface of the reflective layer140, the diffusion barrier layer 166 may be bent upwards from thereflective layer 140 and, as such, may be peeled off, as illustrated inFIG. 5. The possibility that such peeling-off occurs may be very highbecause the diffusion barrier layer 166 is made of a material havinghigh conductivity and high thermal expansion coefficient.

To this end, in the light emitting device 100A according to theembodiment, the diffusion barrier layer 164 may not be formed at theentirety of the first areas A11 and A12 and second area A2 of thereflective layer 140, but may be locally disposed only at the secondarea A2 of the reflective layer 140, as illustrated in FIGS. 2 and 3. Inthis case, the diffusion barrier layer 164 may not be peeled off fromthe reflective layer 140 because the diffusion barrier layer 164 islocally disposed only at the second area A2.

In addition, the thickness of the diffusion barrier layer 164 in thethickness direction of the light emitting structure 130 (for example,the x-axis direction), namely, a first thickness t1, may be greater thana second thickness t2 of the first electrode 162.

When the first thickness t1 of the diffusion barrier layer 164 in thethickness direction of the light emitting structure 130 is less than 50nm, it may be difficult to prevent diffusion of the constituent atoms ofthe second bonding layer 174 because the first thickness t1 of thediffusion barrier layer 164 is too small. On the other hand, when thefirst thickness t1 of the diffusion barrier layer 164 is more thanseveral μm, the total thickness of the light emitting device 100A may beincreased because the because diffusion barrier layer 164 is too thick,even though the function of the diffusion barrier layer 164 is achieved.Accordingly, the first thickness t1 of the diffusion barrier layer 164may be 50 nm to several μm, but the embodiment is not limited to thefirst thickness t1 ranged as described above.

Meanwhile, the diffusion barrier layer 164 and the first electrode 162may be made of the same material or different materials. For example,the diffusion barrier layer 164 may be made of Ni, Ti, Pt, or W, and thefirst electrode 162 may be made of a material different from theabove-described materials.

In addition, although the diffusion barrier layer 164 of the lightemitting device 100A illustrated in FIG. 4 is illustrated as having acircular planar shape, the embodiment is not limited thereto. That is,although not shown, the diffusion barrier layer 164 may have an ovalplanar shape or a polygonal planar shape, in place of the circularplanar shape, in accordance with another embodiment.

In addition, although the first insulating layer 152 surrounding thediffusion barrier layer 164 in the light emitting device 100Aillustrated in FIG. 4 is illustrated as having a circular planar shape,the embodiment is not limited thereto. That is, although not shown, thefirst insulating layer 152 may surround the diffusion barrier layer 164while having oval planar shape or a polygonal planar shape, in place ofthe circular planar shape, in accordance with another embodiment.

In addition, the planar shape of the diffusion barrier layer 164 and theplanar shape of the first insulating layer 152 surrounding the diffusionbarrier layer 164 in the light emitting device 100A illustrated in FIG.4 are illustrated as being identical, the embodiment is not limitedthereto. That is, the diffusion barrier layer 164 and the firstinsulating layer 152 may have different planar shapes in accordance withanother embodiment.

Meanwhile, the second insulating layer 154 may be disposed above thefirst electrode 162 and the diffusion barrier layer 164. In addition,the second insulating layer 154 may be disposed at the upper portions ofthe first insulating layer 152 and reflective layer 140 exposed betweenthe first electrode 162 and the diffusion barrier layer 164.

The second insulating layer 154 may include at least one of SiO₂, TiO₂,SnO, ZnO, Si_(x)O_(y), Si_(x)N_(y), SiO_(x)N_(y), ITO, or AZO. As shownin FIG. 2, the second insulation layer 154 includes a first portion154-1 contacting an upper surface 162US of the first extending portion162-2, a second portion 154-2 contacting an upper surface 164US of thesecond extending portion 164, and a third portion 154-3 contacting anupper surface of the upper portion 152U of the first insulation layer152. Also, the upper portion 152U of the first insulation layer 152contacts a lower surface 162LS of the first extending portion 162-2 ofthe first electrode 162, and an upper surface of the second contactportion 140 of the second electrode 142. In addition, the upper portion152U of the first insulation layer 152, the second contact portion 140of the second electrode 142, and the first extending portion 162-2 ofthe first electrode 162 are overlapped with each other vertically, andthe second portion 154-2 of the second insulation layer 154, the secondextending portion 164 (diffusion barrier layer), and the second contactportion 140 are overlapped with each other vertically. Further, thethird portion 154-3 of the second insulation layer 154 overlaps thesecond contact portion 140 vertically, and the third portion 154-3 ofthe second insulation layer 154 is not overlapped with the firstelectrode 162 and the second extending portion 164, vertically. Also, awidth of the second contact portion 140 is greater than a width W1 ofthe second extending portion 164, a first height H1 between an uppersurface of the second conductivity type semiconductor layer 136 and theupper surface 164US of the second extending portion 164 is greater thana second height H2 between the upper surface of the second conductivitytype semiconductor layer and the upper surface of the first insulationlayer 152, and a third height H3 between the upper surface of the secondconductivity type semiconductor layer and the upper surface 162US of thefirst extending portion 162-2 is the same as the first height H1 betweenthe upper surface of the second conductivity type semiconductor layerand the upper surface 164US of the second extending portion 164.

In addition, the first insulating layer 152 and second insulating layer154 may be made of different materials or the same material, but theembodiment is not limited to the materials of the first and secondinsulating layers 152 and 154.

Meanwhile, the first bonding layer (pad) 172 may be electricallyconnected to the first electrode 162 with passing through the secondinsulating layer 154, and the second bonding layer (pad) 174 may beelectrically connected to the second conductivity type semiconductorlayer 136 via the diffusion barrier layer 164 with passing through thesecond insulating layer 154. In addition, as shown in FIG. 2, the firstextending portion 162-2 of the first electrode 162 and the secondextending portion 164 of the second electrode 142 are not overlappedwith each other vertically, the first pad 172 contacts the firstextending portion 162-2 of the first electrode 162, and the second pad174 contacts the second extending portion 164 of the second electrode142. Also, the first extending portion 162-2 of the first electrode 162and the second extending portion 164 of the second electrode 142 aredisposed on the second contact portion 140 of the second electrode 142,the first extending portion 162-2 of the first electrode and the secondextending portion 142 of the second electrode are spaced apart from eachother, and the first extending portion 162-2 of the first electrodefurther includes a side surface 162SS disposed between the upper surface162US and the lower surface 162LS of the first extending portion 162-2.In addition, the second extending portion 164 of the second electrodefurther includes a lower surface 164LS opposite to the upper surface164US of the second extending portion 164, and a side surface 164SSdisposed between the upper surface 164US and the lower surface 164LS ofthe second extending portion 164, and the third portion 154-3 of thesecond insulation layer 154 is disposed between the side surface 162SSof the first extending portion 162-2 and the side surface 164SS of thesecond extending portion 164.

The above-described first electrode 162 may function to cause the firstbonding layer 172 to supply first conductivity type carriers to theactive layer 134. The diffusion barrier layer 164 may function to supplysecond conductivity type carriers to the active layer 134.

When the first conductivity type carriers are electrons, and the secondconductivity type carriers are holes, the first electrode 162 maycorrespond to a cathode of the light emitting device 100A, and thediffusion barrier layer 164 may correspond to an anode of the lightemitting device 100A.

Conversely, when the first conductivity type carriers may bee holes, andthe second conductivity type carriers may be electrons. In this case,the diffusion barrier layer 164 may function as the second electrode.Accordingly, the first conductivity type carriers supplied from thefirst electrode 162 and the second conductivity type carries suppliedfrom the diffusion barrier layer 164 may be re-combined in the activelayer 134 and, as such, light may be emitted.

In addition, in order to achieve the above-described function of thediffusion barrier layer 164, namely, to prevent the constituent atoms ofthe second bonding layer 174 from being diffused into at least one ofthe reflective layer 140 or light emitting structure 130, the width of aportion of the diffusion barrier layer 164 contacting the reflectivelayer 140 at the second area A2, namely, a first width W1, may be equalto or greater than the width of a portion of the second bonding layer174 passing through the second insulating layer 154, namely, a secondwidth W2.

FIG. 6 illustrates a plan view of a light emitting device 100B accordingto another embodiment corresponding to the embodiment in which the lowerstructure including the elements 110 and the elements 182 to 194, andthe first and second bonding layers 172 and 174 are removed from thelight emitting device 100A illustrated in FIGS. 1 and 2.

In the case of the light emitting device 100B illustrated in FIG. 6, thefirst electrode is divided into a 1-1-th electrode 162-1 and a 1-2-thelectrode 162-2, differently than the light emitting device 100A of theembodiment illustrated in FIG. 4. The 1-1-th electrode 162-1 and the1-2-th electrode 162-2 may be electrically insulated from each other bythe first insulating layer 152. Except for the above-describeddifferences, the light emitting device 100B in FIG. 6 is identical tothe light emitting device illustrated in FIG. 4, and, as such, norepeated description will be given.

Although the first and second bonding layers 172 and 174 in the lightemitting device 100A illustrated in FIG. 1 is illustrated as having arectangular planar shape, the embodiment is not limited thereto. Thatis, although not shown, each of the first and second bonding layers 172and 174 may have a polygonal planar shape, a circular planar shape or anoval planar shape, in place of the rectangular planar shape, inaccordance with another embodiment.

Hereinafter, the lower structure including the element 110 and theelements 182 to 194 will be described with reference to FIGS. 2 and 3.

The first and second metal pads 192 and 194 may be disposed on thesub-mount 110 while being spaced apart from each other in a horizontaldirection (for example, the z-axis direction).

The sub-mount 110 may be constituted by a semiconductor substrate madeof AlN, BN, silicon carbide (SiC), GaN, GaAs, Si, or the like, but theembodiment is not limited thereto. For example, the sub-mount 110 may bemade of a semiconductor material having thermal characteristics.

When the sub-mount 110 is made of Si, a passivation layer (not shown)may further be interposed between the first and second electrode pads192 and 194 and the sub-mount 110. In this case, the passivation layermay be made of an insulating material.

In addition, the first and second conductivity type semiconductor layers132 and 136 of the light emitting structure 130 may be electricallyconnected to the first and second metal pads 192 and 194 via the firstand second bumps 182 and 184, respectively.

The first bump 182 may be interposed between the first bonding layer 172and the first metal pad 192. Accordingly, the first metal pad 192 may beelectrically connected to the first conductivity type semiconductorlayer 132 via the first bump 182, first bonding layer 172 and firstelectrode 162.

Similarly, the second bump 182 may be interposed between the secondbonding layer 174 and the second metal pad 194. Accordingly, the secondmetal pad 194 may be electrically connected to the second conductivitytype semiconductor layer 136 via the second bump 184, second bondinglayer 174 and diffusion barrier layer 164.

Although not shown, a first upper bump metal layer (not shown) mayfurther be interposed between the first bonding layer 172 and the firstbump 182, and a first lower bump metal layer (not shown) may further beinterposed between the first electrode pad 192 and the first bump 182.In this case, the first upper bump metal layer and the first lower bumpmetal layer function to indicate a location where the first bump 182will be positioned. Similarly, a second upper bump metal layer (notshown) may further be interposed between the second bonding layer 174and the second bump 184, and a second lower bump metal layer (not shown)may further be interposed between the second electrode pad 194 and thesecond bump 184. In this case, the second upper bump metal layer and thesecond lower bump metal layer function to indicate a location where thesecond bump 184 will be positioned.

If necessary, the first and second bumps 182 and 184 may be dispensedwith when the first and second bonding layers 172 and 174 perform thefunctions of the first and second bumps 182 and 184, respectively.

Hereinafter, a method for manufacturing the light emitting device 100Aillustrated in FIGS. 1 and 2 will be described with reference to theaccompanying drawings, but the embodiment is not limited thereto. Thatis, the light emitting device 100A may be manufactured using anothermethod.

FIGS. 7a to 7h are sectional views explaining respective processes of amethod for manufacturing the upper structure including the elements 120to 174 in the light emitting device 100A illustrated in FIG. 2.

As illustrated in FIG. 7a , the substrate 120 is prepared. For example,the substrate 120 may be made of at least one of sapphire (Al₂O₃), SiC,GaAs, GaN, ZnO, Si, GaP, InP, or Ge, but the embodiment is not limitedthereto.

Thereafter, as illustrated in FIG. 7b , the light emitting structure 130may be formed through sequential growth of the first conductivity typesemiconductor layer 132, active layer 134 and second conductivity typesemiconductor layer 136 over the substrate 120. The light emittingstructure 130 may be formed using, for example, metal organic chemicalvapor deposition (MOCVD), chemical vapor deposition (CVD),plasma-enhanced chemical vapor deposition (PECVD), molecular beamepitaxy (MBE), hydride vapor phase epitaxy (HVPE), or the like, but theembodiment is not limited thereto.

Subsequently, the reflective layer 140 is formed over the light emittingstructure 130. The reflective layer 140 may be made of Ni, Al, Rh, Pd,Ir, Ru, Mg, Zn, Pt, Au, Hf or a selective combination thereof.

Thereafter, as illustrated in FIG. 7c , first blind holes OP1 are formedat portions of the first and second areas A11 and A12 of the reflectivelayer 140, respectively, such that the first blind holes OP1 extend tothe first conductivity type semiconductor 132 with passing through thesecond conductivity type semiconductor layer 136 and active layer 134.

Subsequently, as illustrated in FIG. 7d , the first insulating layer 152is formed at side surfaces of the first blind holes OP1. In this case,portions of the first conductivity type semiconductor layer 132 disposedbeneath the first blind holes OP1 are exposed. Also, as shown in FIG. 7d, the upper portion 152U of the first insulation layer includes a firstopened region 1520P on the second conductivity type semiconductor layer.Also, the second extending portion 164 is disposed in the first openedregion 1520P, and the second extending portion 164 contacts the secondcontact portion 140.

As illustrated in FIG. 7e , a mask pattern M is then formed over theexposed reflective layer 140. In this case, the mask pattern M may opena region where the diffusion barrier layer 164 will be formed and aregion where the first electrode 162 will be formed.

Thereafter, as illustrated in FIG. 7f , the diffusion barrier layer 164and the first electrode 162 are formed using the mask pattern M inaccordance with a general photolithography process. The mask pattern Mis then removed.

FIGS. 7e and 7f are sectional views illustrating processes used in thecase in which the diffusion barrier layer 164 and the first electrode162 are formed using the same material. However, the processesillustrated in FIGS. 7E and 7F may be varied in order to form thediffusion barrier layer 164 and the first electrode 162 using differentmaterials. That is, the diffusion barrier layer 164 may first be formed,and the first electrode 162 may then be formed in accordance with ageneral photolithography process. Alternatively, the first electrode 162may first be formed, and the diffusion barrier layer 164 may then beformed.

Subsequently, as illustrated in FIG. 7g , the second insulating layer154 is formed over the resultant structure illustrated in FIG. 7f . Thatis, the second insulating layer 154 is formed entirely over the firstelectrode 162, the diffusion barrier layer 164 and the exposed portionof the reflective layer 140, and the exposed upper surface of the firstinsulating layer 152. The second insulating layer 154 is then etched inaccordance with a general photolithography process and, as such, secondblind holes OP2 are formed. Also, the second insulation layer 154includes a second opened area OP2, the first pad 172 contacts the firstextending portion 162-2 via the second opened area OP2 of the secondinsulation layer, and the second pad 174 contacts the second extendingportion 164 via the second opened area OP2 of the second insulationlayer.

As illustrated in FIG. 7h , the second blind holes OP2 are then plugged,thereby forming the first and second bonding layers 172 and 174. Inaddition, the resultant structure illustrated in FIG. 7h may besubjected to a lapping process and a polishing process. FIG. 7h alsoillustrates the first extending portion 162-2.

FIGS. 8a and 8b are sectional views explaining processes of a method formanufacturing the lower structure including the element 110 and theelements 182 to 194 in the light emitting device 100A illustrated inFIG. 2.

The processes for manufacturing the lower structure including theelement 110 and the elements 182 to 194 may be carried outsimultaneously with the processes illustrated in FIGS. 7a to 7 h.

As illustrated in FIG. 8a , the first and second metal pads 192 and 194are formed on the sub-mount 110. The sub-mount 110 may be constituted bya semiconductor substrate made of AlN, BN, silicon carbide (SiC), GaN,GaAs, Si, or the like, but the embodiment is not limited thereto. Forexample, the sub-mount 110 may be made of a semiconductor materialhaving thermal characteristics.

The first and second metal pads 192 and 194 may be formed on thesub-mount 110 while being spaced apart from each other in a horizontaldirection.

When the sub-mount 110 is made of Si, a passivation layer (not shown)may further be formed over the sub-mount 110 before formation of thefirst and second metal pads 192 and 194. In this case, the first andsecond metal pads 192 and 194 are formed on the passivation layer afterformation of the passivation layer.

Thereafter, as illustrated in FIG. 8b , the first and second bumps 182and 184 are formed on the first and second metal pads 192 and 194,respectively.

Subsequently, the upper structure illustrated in FIG. 7h is disposed onthe lower structure illustrated in FIG. 8b and, as such, the lightemitting device 100A illustrated in FIG. 2 is completed. That is, theresultant structure illustrated in FIG. 7h is rotated such that thesubstrate 120 is directed upwards, and is then coupled to the resultantstructure illustrated in FIG. 8b . At this time, as illustrated in FIG.2, the first bonding layer 172 and the first metal pad 192 may becoupled to the first bump 182, and the second bonding layer 174 and thesecond electrode pad 194 may be coupled by the second bump 182.

Hereinafter, the configuration and operation of a light emitting devicepackage including the light emitting device 100A illustrated in FIG. 2will be describe.

FIG. 9 illustrates a sectional view of a light emitting device package200A according to an embodiment.

The light emitting device package 200A in FIG. 9 may include a lightemitting device 100A, a header 210, a pair of leads 222 and 224, a bond230, a molding member 240, first and second wires 252 and 254, and aside wall 260.

The light emitting device 100A is the light emitting device illustratedin FIGS. 1 and 2 and, as such, no detailed description thereof will begiven under the condition that the same reference numerals are used. Ofcourse, the light emitting device 100B in FIG. 6 may be implemented inthe case of FIG. 9, in place of the light emitting device 100A.

The sub-mount 110 may be connected to the header 210 by the bond 230.The bond 230 may take the form of a solder or a paste. The first andsecond metal pads 192 and 194 of the light emitting device 100A may beconnected to the leads 222 and 224 by the first and second wires 252 and254, respectively. Electric power is supplied to the light emittingdevice 100A via the leads 222 and 224, which are electrically isolatedfrom each other.

The molding member 240 may fill a cavity formed by the side wall 260and, as such, surrounds the light emitting device 100A, therebyprotecting the light emitting device 100A. In addition, the moldingmember 240 may contain a fluorescent substance and, as such, may varythe wavelength of light emitted from the light emitting device 100A.

Such light emitting device packages according to the embodiment may bearrayed on a substrate. Optical members, namely, light guide plates,prism sheets, diffusion sheets, etc., may be arranged on optical pathsof the light emitting device packages. Such light emitting devicepackages, substrate and optical members may function as a backlightunit.

In addition, a display apparatus, an indicating apparatus or a lightingapparatus may be implemented including the light emitting device packageaccording to the embodiment.

In this case, the display apparatus may include a bottom cover, areflective plate arranged on the bottom cover, a light emitting modulefor emitting light, a light guide plate arranged in front of thereflective plate, to guide light emitted from the light emitting modulein a forward direction, an optical sheet arranged in front of the lightguide plate while including prism sheets, a display pane arranged infront of the optical sheet, an image signal output circuit connected tothe display panel, to supply an image signal to the display panel, and acolor filter arranged in front of the display panel. In this case, thebottom cover, reflective plate, light emitting module, light guide plateand optical sheet may constitute a backlight unit.

Meanwhile, the lighting apparatus may include a light source moduleincluding a substrate and the light emitting device package according tothe embodiment, a radiator for dissipating heat from the light sourcemodule, and a power supplier for processing or converting an electricalsignal received from outside, and supplying the resultant signal to thelight source module. For example, the lighting apparatus may include alamp, a headlamp, or a street lamp.

The head lamp may include a light emitting module including lightemitting device packages arranged on a substrate, a reflector forreflecting light emitted from the light emitting module in a certaindirection, for example, a forward direction, a lens for refracting lightreflected by the reflector in a forward direction, and a shade forpartially blocking or reflecting light directed to the lens after beingreflected by the reflector, to obtain a backlight pattern desired by thedesigner.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and applications may be devised by those skilled inthe art that will fall within the intrinsic aspects of the embodiments.More particularly, various variations and modifications are possible inconcrete constituent elements of the embodiments. In addition, it is tobe understood that differences relevant to the variations andmodifications fall within the spirit and scope of the present disclosuredefined in the appended claims.

Various embodiments have been described in the best mode for carryingout the invention.

The light emitting device and light emitting device package according tothe embodiments are applicable to a display apparatus, an indicatingapparatus, a lighting apparatus or the like.

What is claimed is:
 1. A light emitting device comprising: a substrate;a light emitting structure disposed on the substrate; a first insulationlayer disposed on the light emitting structure; a second insulationlayer disposed on the first insulation layer; a first electrode and asecond electrode electrically connected to the light emitting structure;a first pad electrically connected to the first electrode; and a secondpad electrically connected to the second electrode, wherein the lightemitting structure includes a first conductivity type semiconductorlayer, an active layer disposed on the first conductivity typesemiconductor layer, and a second conductivity type semiconductor layerdisposed on the active layer, wherein the first electrode includes afirst contact portion contacting the first conductivity typesemiconductor layer, and a first extending portion disposed on thesecond conductivity type semiconductor layer, wherein the secondelectrode includes a second contact portion contacting the secondconductivity type semiconductor layer, and a second extending portiondisposed on the second contact portion, wherein the first insulationlayer includes a lower portion contacting the first conductivity typesemiconductor layer, and an upper portion disposed on the second contactportion, wherein the second insulation layer includes a first portioncontacting an upper surface of the first extending portion, a secondportion contacting an upper surface of the second extending portion, anda third portion contacting an upper surface of the upper portion of thefirst insulation layer, wherein the upper portion of the firstinsulation layer contacts a lower surface of the first extending portionof the first electrode, and an upper surface of the second contactportion of the second electrode, wherein the upper portion of the firstinsulation layer, the second contact portion of the second electrode,and the first extending portion of the first electrode are overlappedwith each other vertically, wherein the second portion of the secondinsulation layer, the second extending portion, and the second contactportion are overlapped with each other vertically, wherein the thirdportion of the second insulation layer overlaps the second contactportion vertically, wherein the third portion of the second insulationlayer is not overlapped with the first electrode and the secondextending portion, vertically, wherein the first extending portion ofthe first electrode and the second extending portion of the secondelectrode are not overlapped with each other vertically, wherein thefirst pad contacts the first extending portion of the first electrode,and wherein the second pad contacts the second extending portion of thesecond electrode.
 2. The light emitting device of claim 1, wherein thefirst extending portion of the first electrode and the second extendingportion of the second electrode are disposed on the second contactportion of the second electrode, and wherein the first extending portionof the first electrode and the second extending portion of the secondelectrode are spaced apart from each other.
 3. The light emitting deviceof claim 2, wherein the first extending portion of the first electrodefurther includes a side surface disposed between the upper surface andthe lower surface of the first extending portion, wherein the secondextending portion of the second electrode further includes a lowersurface opposite to the upper surface of the second extending portion,and a side surface disposed between the upper surface and the lowersurface of the second extending portion, and wherein the third portionof the second insulation layer is disposed between the side surface ofthe first extending portion and the side surface of the second extendingportion.
 4. The light emitting device of claim 3, wherein the sidesurface of the first extending portion and the side surface of thesecond extending portion face each other and are spaced apart from eachother on the second contact portion of the second electrode.
 5. Thelight emitting device of claim 4, wherein the third portion of thesecond insulation layer is not overlapped with the first pad,vertically.
 6. The light emitting device of claim 1, wherein the firstinsulation layer includes a first material, wherein the secondinsulation layer includes a second material, and wherein the firstmaterial is different from the second material.
 7. The light emittingdevice of claim 6, wherein the first material includes silicon oxide,and wherein the second material includes silicon nitride.
 8. The lightemitting device of claim 7, wherein a width of the second contactportion is greater than a width of the second extending portion.
 9. Thelight emitting device of claim 3, wherein a first height between anupper surface of the second conductivity type semiconductor layer andthe upper surface of the second extending portion is greater than asecond height between the upper surface of the second conductivity typesemiconductor layer and the upper surface of the first insulation layer.10. The light emitting device of claim 9, wherein a third height betweenthe upper surface of the second conductivity type semiconductor layerand the upper surface of the first extending portion is the same as thefirst height between the upper surface of the second conductivity typesemiconductor layer and the upper surface of the second extendingportion.
 11. The light emitting device of claim 1, wherein the upperportion of the first insulation layer includes a first opened region onthe second conductivity type semiconductor layer, wherein the secondextending portion is disposed in the first opened region, and whereinthe second extending portion contacts the second contact portion. 12.The light emitting device of claim 11, wherein the second insulationlayer includes a second opened area, wherein the first pad contacts thefirst extending portion via the second opened area of the secondinsulation layer, and wherein the second pad contacts the secondextending portion via the second opened area of the second insulationlayer.
 13. The light emitting device of claim 12, wherein a portion ofthe first pad contacts the second insulation layer.
 14. The lightemitting device of claim 1, wherein the second pad includes a lowersurface contacting the second extending portion, and wherein a width ofthe second extending portion is greater than a width of the lowersurface of the second pad.
 15. A light emitting device comprising: asubstrate; a light emitting structure disposed on the substrate; a firstinsulation layer disposed on the light emitting structure; a secondinsulation layer disposed on the first insulation layer; a firstelectrode and a second electrode electrically connected to the lightemitting structure; a first pad electrically connected to the firstelectrode; and a second pad electrically connected to the secondelectrode, wherein the light emitting structure includes a firstconductivity type semiconductor layer, an active layer disposed on thefirst conductivity type semiconductor layer, a second conductivity typesemiconductor layer disposed on the active layer, wherein the firstelectrode includes a first contact portion contacting the firstconductivity type semiconductor layer, and a first extending portiondisposed on the second conductivity type semiconductor layer, whereinthe second electrode includes a second contact portion contacting thesecond conductivity type semiconductor layer, and a second extendingportion disposed on the second contact portion, wherein the firstinsulation layer includes a lower portion contacting the firstconductivity type semiconductor layer, and an upper portion disposed onthe second contact portion, wherein the upper portion of the firstinsulation layer contacts a lower surface of the first extending portionof the first electrode, and an upper surface of the second contactportion of the second electrode, and wherein the upper portion of thefirst insulation layer, the second contact portion of the secondelectrode, and the first extending portion of the first electrode areoverlapped with each other vertically, wherein the first extendingportion of the first electrode and the second extending portion of thesecond electrode are not overlapped with each other vertically on thesecond contact portion of the second electrode, wherein the secondinsulation layer includes a first portion contacting an upper surface ofthe first extending portion, a second portion contacting an uppersurface of the second extending portion, a third portion contacting anupper surface of the first insulation layer, wherein the first portion,the second portion, and the third portion of the second insulation layerare overlapped with the second contact portion vertically, wherein thethird portion of the second insulation layer is disposed between thefirst extending portion and the second extending portion, wherein thethird portion of the second insulation layer is not overlapped with thefirst electrode and the second extending portion, vertically, whereinthe first pad contacts the first extending portion of the firstelectrode, and wherein the second pad contacts the second extendingportion of the second electrode.